A Multilayer Chip Inductor is a compact, surface-mount component fabricated using advanced ceramic or ferrite layering technology, integrating multiple coil layers within a miniature footprint to deliver stable inductance (nH to µH range) with high efficiency. Designed for high-frequency applications (up to GHz), it features ultra-low DC resistance, excellent Q factor, and minimal parasitic capacitance, making it ideal for noise suppression, impedance matching, and signal filtering in smartphones, IoT devices, RF modules, and power management circuits. Its robust structure ensures reliability under thermal stress and mechanical vibration, while standardized sizes (e.g., 0402, 0603) streamline automated PCB assembly.